Expert Profile
2 years experience in a GaAs power amplifier company in Silicon Valley.
Designed, qualified and released a series of 4W multi-stage flange packaged amplifiers in a short 6 month period.
Designed, qualified and released a series of QFN packaged amplifiers in a short time period.
Assisted in transceiver test and design in the frequency range of 6 GHz to 28 GHz. This included technology transfer to the facility in Shanghai, China.
Worked briefly on Microwave packaging using LTCC technology
Worked briefly at Micron ***** as Package Design Engineer for high speed memory products - 2 conference papers published in the EPTC 2010.
Currently working towards PhD in Microwave Engineering in the ***** University of ***** (NUS)
*****, H.R. and K. Mouthaan, “Passive short range X-band frequency doubling transponder”, European Radar Conference, 2009. EuRAD 2009. Pages 597 – 600.
Hongzhao Ray *****, G. Cao, E. Gharavol, K. Tom, K. Mouthaan, “60 GHz short range planar RSS localization”, Asia-Pacific Microwave Conference 2010.
Hongwan Ng, Aichie Wang, Hongzhao Ray *****, “A sensitivity study on BGA package parameters that affect pin capacitance”, 12th Electronics Packaging Technology Conference 2010.
Chinhui Chong, Sook Har Leong, Aichie Wang, Hongzhao Ray *****, ”BGA package design for reduced gold wire length and package parasitic with etch-back process”, 12th Electronic Packaging Technology Conference 2010