Sic Wafer Chip - Fabrication, Value Chain, Technical Challenges
Looking for experts having information on sic wafer fabrication, processing steps involved, its value chain, challenges involved during fabrication and how it is different than si wafer manufacturing. Following are the key questions, i need information on: what is the current value chain for sic wafers? Does osats, fabless, idms company type exist for sic wafers? Which companies provides sic raw material, sic wafers, sic chip designing, sic final modules? What is the business model for sic wafer followed currently? Is it dominated by the players like cree, wolfspeed, stmicroelectronics or are there other players in the market? What are different technologies used for fabrication of sic wafers to chips? Are the process steps different than si wafer fabrication? Why does sic wafers required 3 times more (2100 vs 700) steps to si wafers? What are the current challenges faced by the fabrication labs? What are the current challenges which sic companies are trying to overcome while fabrication (during inspection, wafer bumps, defects in size, metallurgy of wafers, overlay aspects, flatness issues etc)? What are the key differences between si and sic wafers processing and technologies required for manufacturing? Which technology nodes and wafer size would be used in sic processing in future? What are the key application areas of sic? How does the overall market of sic wafer look like as of today and 10 years from now? What are the growth drivers and challenges?
Ryan |Head of IT Projects and Governance
Do not think I would be a good fit. Good luck!...
1.5 Hours LaterHenning |VP Strategy & New Business
I can discuss and explain most of below questions within publicly available information. ...
1.6 Hours LaterMartine |President and CEO
I have taken apart several SiC MOSFets and LEDs. I am very familiar with their construction. ...
1.6 Hours Later